difference with Surface Mounted Device and Double Sided pcb
Posted: Mon Jul 23, 2012 7:19 amcan you let me know what difference with Surface Mounted Device and Double Sided pcb!thank you!
Cytron Technical Forum
difference with Surface Mounted Device and Double Sided pcb
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Posted: Mon Jul 23, 2012 7:19 amRe: difference with Surface Mounted Device and Double Sided
Posted: Mon Jul 23, 2012 8:56 amYou are trying to compare SMD and PCB? Doesnt really making any sense. I guess you want to know what are both of them?
Re: difference with Surface Mounted Device and Double Sided
Posted: Mon Jul 23, 2012 11:19 amsurface mount component are components mounted to pcb on surface. double layer pcb is pcb with both surfaces have routing
Re: difference with Surface Mounted Device and Double Sided
Posted: Mon Jul 23, 2012 9:15 pmdo you have any detail information ?thank you!
Re: difference with Surface Mounted Device and Double Sided
Posted: Tue Jul 24, 2012 9:38 amGoogle it 
Re: difference with Surface Mounted Device and Double Sided
Posted: Wed Jul 25, 2012 8:04 amIntegrated circuit SMD packages
SOIC - Small Outline Integrated Circuit. This has a dual in line configuration and gull wing leads with a pin spacing of 1.27 mm
TSOP - Thin Small Outline Package. This package is thinner than the SOIC and has a smaller pin spacing of 0.5 mm
SSOP - Shrink Small Outline Package. This has a pin spacing of 0.635 mm
TSSOP - Thin Shrink Small Outline Package.
PLCC - Plastic Leaded Chip Carrier. This type of package is square and uses J-lead pins with a spacing of 1.27 mm
QSOP - Quarter-size Small Outline Package. It has a pin spacing of 0.635 mm
VSOP - Very Small Outline Package. This is smaller than the QSOP and has pin spacing of 0.4, 0.5, or 0.65 mm.
LQFP - Low profile Quad Flat Pack. This package has pins on all four sides. Pin spacing varies according to the IC, but the height is 1.4 mm.
PQFP - Plastic Quad Flat Pack. A square plastic package with equal number of gull wing style pins on each side. Typically narrow spacing and often 44 or more pins. Normally used for VLSI circuits.
CQFP - Ceramic Quad Flat Pack. A ceramic version of the PQFP.
TQFP - Thin Quad Flat Pack. A thin version of the PQFP.
BGA - Ball Grid Array. A package that uses pads underneath the package to make contact wit the printed circuit board. Before soldering the pads appear as solder balls, giving rise to the name. By placing the pads underneath the package there is more room for them, thereby overcoming some of the problems of the very thin leads required for the quad flat packs. The ball spacing on BGAs is typically 1.27 mm.
SOIC - Small Outline Integrated Circuit. This has a dual in line configuration and gull wing leads with a pin spacing of 1.27 mm
TSOP - Thin Small Outline Package. This package is thinner than the SOIC and has a smaller pin spacing of 0.5 mm
SSOP - Shrink Small Outline Package. This has a pin spacing of 0.635 mm
TSSOP - Thin Shrink Small Outline Package.
PLCC - Plastic Leaded Chip Carrier. This type of package is square and uses J-lead pins with a spacing of 1.27 mm
QSOP - Quarter-size Small Outline Package. It has a pin spacing of 0.635 mm
VSOP - Very Small Outline Package. This is smaller than the QSOP and has pin spacing of 0.4, 0.5, or 0.65 mm.
LQFP - Low profile Quad Flat Pack. This package has pins on all four sides. Pin spacing varies according to the IC, but the height is 1.4 mm.
PQFP - Plastic Quad Flat Pack. A square plastic package with equal number of gull wing style pins on each side. Typically narrow spacing and often 44 or more pins. Normally used for VLSI circuits.
CQFP - Ceramic Quad Flat Pack. A ceramic version of the PQFP.
TQFP - Thin Quad Flat Pack. A thin version of the PQFP.
BGA - Ball Grid Array. A package that uses pads underneath the package to make contact wit the printed circuit board. Before soldering the pads appear as solder balls, giving rise to the name. By placing the pads underneath the package there is more room for them, thereby overcoming some of the problems of the very thin leads required for the quad flat packs. The ball spacing on BGAs is typically 1.27 mm.
Re: difference with Surface Mounted Device and Double Sided
Posted: Wed Jul 25, 2012 9:08 pmfor double sided circuit???
Re: difference with Surface Mounted Device and Double Sided
Posted: Wed Jul 25, 2012 11:05 pmWhat are the details you are searching for? I believe yonghui has explained it?
Re: difference with Surface Mounted Device and Double Sided
Posted: Thu Jul 26, 2012 7:29 amcan give more information for this 2 type PCb!thank you!
Re: difference with Surface Mounted Device and Double Sided
Posted: Thu Jul 26, 2012 11:14 amvitor85 WROTE:can give more information for this 2 type PCb!thank you!
There is only one type of PCB you have mentioned here, which, is double sided PCB.